30Khz Semiconductor Lens Ultrasonic Spray Scattering Nozzle with Low Power
Description:
The typical application of scattering type ultrasonic nozzles is the photoresist coating on semiconductor chips, where the photoresist is sprayed onto the semiconductor chips. Due to the rotational scattering of mist emitted by the scattering type ultrasonic nozzle, a uniform photoresist film can be formed not only on the wafer plane, but also on the sidewalls and corners of the wafer microstructure. In addition, scattering ultrasonic nozzles can also be used for thin film solar cell coatings, calcium titanate solar cell coatings, AR transmission and reflection film coatings, insulation film coatings, superhydrophobic coating coatings, PCB flux coatings, and other applications.
Parameters:
| Model | FSW-3002-L |
| Name | 30Khz Scattering Ultrasonic Nozzle Atomization |
| Frequency | 30Khz |
| Atomized particle size range(μm) | 15-40 |
| Spray width(mm) | 40-80 |
| Spray flow(ml/min) | 0.5-20 |
| Spray height(mm) | 30-80 |
| Liquid viscosity (cps) | <30 |
| Particle size (μm) | <15 |
| Diversion pressure (Mpa) | <0.05 |
| Application | Suitable for Photoresist coatings on semiconductor chips |
Advantages:
1. Large surface spraying, spraying width: 40-150mm
2. Coating uniformity:>95% uniformity
3. Saving raw materials: The utilization rate of raw materials is over 85%, which is 4 times higher than traditional two fluid spraying
4. High precision in coating thickness control: can prepare coatings ranging from 20nm to tens of micrometers, with precise control of coating thickness
5. Fine atomized particles
6. Uniform atomization of particles
7. It can be sprayed intermittently or continuously
8. Ultra low spray flow
9. Will not block the nozzle
10. Anti corrosion nozzle
11. High precision and controllable spraying
30Khz Semiconductor Lens Ultrasonic Spray Scattering Nozzle with Low Power
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30Khz Semiconductor Lens Ultrasonic Spray Scattering Nozzle With Low Power Images
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